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2506033317H0中文资料

  • 电子元器件
  • 中文功能描述
  • 生产厂商
  • 品牌LOGO
  • 页数
  • 文件大小
  • PDF文件
  • 2506033317H0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 315.16 Kbytes
  • 2506036007Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 294.05 Kbytes
  • 2506036007Z0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 289.49 Kbytes
  • 2506036017Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 298.47 Kbytes
  • 2506038007Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 293.91 Kbytes
  • 250607B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 2 Pages
  • 165.54 Kbytes
  • 250651B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 218.94 Kbytes
  • 250652B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 194.71 Kbytes
  • 250654B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 2 Pages
  • 178.89 Kbytes
  • 250686-007
  • MULTI-LAYER CHIP BEAD
  • INTEL
    Intel Corporation
  • INTEL
  • 97 Pages
  • 5320.52 Kbytes
  • 250688-002
  • MULTI-LAYER CHIP BEAD
  • INTEL
    Intel Corporation
  • INTEL
  • 97 Pages
  • 5320.52 Kbytes
  • 2507
  • MULTI-LAYER CHIP BEAD
  • KR
    KR Electronics, Inc.
  • KR
  • 2 Pages
  • 21.82 Kbytes
  • 250701B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 199.72 Kbytes
  • 250704B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 192.46 Kbytes
  • 250752B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 2 Pages
  • 178.28 Kbytes
  • 2508
  • MULTI-LAYER CHIP BEAD
  • KR
    KR Electronics, Inc.
  • KR
  • 2 Pages
  • 23.42 Kbytes
  • 2508-16N-L
  • MULTI-LAYER CHIP BEAD
  • COILCRAFT
    Coilcraft lnc.
  • COILCRAFT
  • 2 Pages
  • 221.01 Kbytes
  • 2508-18N-L
  • MULTI-LAYER CHIP BEAD
  • COILCRAFT
    Coilcraft lnc.
  • COILCRAFT
  • 2 Pages
  • 221.01 Kbytes
  • 2508-23N-L
  • MULTI-LAYER CHIP BEAD
  • COILCRAFT
    Coilcraft lnc.
  • COILCRAFT
  • 2 Pages
  • 221.01 Kbytes
  • 2508-27N-L
  • MULTI-LAYER CHIP BEAD
  • COILCRAFT
    Coilcraft lnc.
  • COILCRAFT
  • 2 Pages
  • 221.01 Kbytes
  • 250801B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 2 Pages
  • 167.19 Kbytes
  • 250802B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 2 Pages
  • 167.70 Kbytes
  • 2508051017Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 290.05 Kbytes
  • 2508051027Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 308.54 Kbytes
  • 2508051107Y0
  • MULTI-LAYER CHIP BEAD
  • FREESCALE
    Freescale Semiconductor, Inc
  • FREESCALE
  • 27 Pages
  • 1437.44 Kbytes
  • 2508051107Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 277.33 Kbytes
  • 2508051217Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 297.02 Kbytes
  • 2508051217Z0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 287.93 Kbytes
  • 2508051527Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 308.78 Kbytes
  • 2508051817Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 2 Pages
  • 231.41 Kbytes
  • 2508052027Z0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 295.69 Kbytes
  • 2508053007Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 280.11 Kbytes
  • 2508053017Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 303.63 Kbytes
  • 2508053017Z0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 288.83 Kbytes
  • 2508055007Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 280.24 Kbytes
  • 2508056007Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 293.04 Kbytes
  • 2508056007Z0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 283.11 Kbytes
  • 2508056017Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 298.60 Kbytes
  • 2508056017Y2
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 2 Pages
  • 239.42 Kbytes
  • 2508059007Y0
  • MULTI-LAYER CHIP BEAD
  • FAIR-RITE
    Fair-Rite Products Corp.
  • FAIR-RITE
  • 3 Pages
  • 294.56 Kbytes
  • 250851B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 213.59 Kbytes
  • 2509
  • MULTI-LAYER CHIP BEAD
  • KR
    KR Electronics, Inc.
  • KR
  • 2 Pages
  • 90.32 Kbytes
  • 250903B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 200.10 Kbytes
  • 250904B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 200.03 Kbytes
  • 250905B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 201.16 Kbytes
  • 250906B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 200.20 Kbytes
  • 250907B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 194.85 Kbytes
  • 250910B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 214.86 Kbytes
  • 250912B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 5 Pages
  • 213.15 Kbytes
  • 250929B
  • MULTI-LAYER CHIP BEAD
  • ITF
    Integrated Technology Future
  • ITF
  • 2 Pages
  • 168.68 Kbytes

2506033317H0参数资料

  • 电子元器件
  • 参数资料
  • 2506033317H0
  • 功能描述：电磁干扰滤波珠子、扼流圈和阵列 MULTILAYER CHIP BEAD Z=330 OHM@100MHz 25% ；RoHS：否；制造商：AVX；阻抗：；最大直流电流：35 mA；最大直流电阻：；容差：；端接类型：SMD/SMT；电压额定值：25 V；工作温度范围：- 25 C to + 85 C；封装 / 箱体：0603 (1608 metric)；

2506033317H0供应商

  • 电子元器件
  • 供应商
  • 联系方式
  • 品牌
  • 封装
  • 批号
  • 数量
  • 2506033317H0
  • 深圳市希普诚电子科技有限公司
  • 叶先生/李小姐
    0755-88914419
  • FAIR-RITE
  • SMD0603
  • 15+
  • 16500
  • 2506033317H0
  • 深圳市冠亚达电子有限公司
  • 彭先生/孙先生
    0755-83980810
  • Fair-Rite Products Corp
  • 48000
  • 2506033317H0
  • 深圳市骏创达科技有限公司
  • 唐小姐
    0755-22929758
  • FAIR-RITE
  • 原厂封装
  • 15+
  • 57200
  • 2506033317H0
  • 深圳市中品正光科技有限公司
  • 王先生
    0755-84163050
  • FAIR-RITE
  • 2506033317H0
  • 1249+
  • 4000
  • 2506033317H0
  • mmic_stock
  • vivi
    -
  • Fair-Rite
  • 12+
  • 9800