LSM10A-D3

LSM10A-D3中文资料

• 电子元器件
• 中文功能描述
• 生产厂商
• 品牌LOGO
• 页数
• 文件大小
• PDF文件

• LSM10A-D3
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 13 Pages
• 428.22 Kbytes

• LSM10A-D5
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 13 Pages
• 400.73 Kbytes

• LSM115J
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 99.79 Kbytes

• LSM140
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 91.53 Kbytes

• LSM140
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 101.04 Kbytes

• LSM140G
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 94.08 Kbytes

• LSM140J
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 94.36 Kbytes

• LSM140_07
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 101.04 Kbytes

• LSM145
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 91.53 Kbytes

• LSM145
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 101.04 Kbytes

• LSM145G
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 94.08 Kbytes

• LSM145J
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 94.36 Kbytes

• LSM150
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 91.53 Kbytes

• LSM150
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 101.04 Kbytes

• LSM150G
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 94.08 Kbytes

• LSM150J
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 94.36 Kbytes

• LSM16A-D12
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 12 Pages
• 372.17 Kbytes

• LSM16A-W3
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 12 Pages
• 350.04 Kbytes

• LSM2-T
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 12 Pages
• 2003.20 Kbytes

• LSM2-T30-D12
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 12 Pages
• 397.87 Kbytes

• LSM2-T30-D12-C
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 12 Pages
• 2003.20 Kbytes

• LSM2-T30-D12R-C
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MURATA
  Murata Manufacturing Co., Ltd.
• 
• 12 Pages
• 2003.20 Kbytes

• LSM303DLH
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 47 Pages
• 591.25 Kbytes

• LSM303DLH
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 47 Pages
• 608.24 Kbytes

• LSM303DLHC
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 43 Pages
• 579.06 Kbytes

• LSM303DLHC
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 42 Pages
• 619.47 Kbytes

• LSM303DLHCTR
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 42 Pages
• 619.47 Kbytes

• LSM303DLHTR
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 47 Pages
• 608.24 Kbytes
• PDF文件

• LSM303DLM
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 38 Pages
• 512.21 Kbytes

• LSM303DLMTR
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 38 Pages
• 512.21 Kbytes

• LSM315
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 101.85 Kbytes

• LSM320HAY30
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 42 Pages
• 507.27 Kbytes
• PDF文件

• LSM320HAY30TR
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 42 Pages
• 507.27 Kbytes
• PDF文件

• LSM330DL
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 54 Pages
• 1070.09 Kbytes
• PDF文件

• LSM330DLC
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 66 Pages
• 1469.76 Kbytes

• LSM330DLCTR
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 66 Pages
• 1469.76 Kbytes

• LSM330DLTR
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• STMICROELECTRONICS
  STMicroelectronics
• 
• 54 Pages
• 1070.09 Kbytes
• PDF文件

• LSM335
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 99.00 Kbytes

• LSM340
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 99.00 Kbytes

• LSM345
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 99.00 Kbytes

• LSM535
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 100.40 Kbytes

• LSM540
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 100.40 Kbytes

• LSM545
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 100.40 Kbytes

• LSM615
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• MICROSEMI
  Microsemi Corporation
• 
• 2 Pages
• 104.91 Kbytes

• LSM670
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• SIEMENS
  Siemens Semiconductor Group
• 
• 8 Pages
• 49.14 Kbytes

• LSM670-HK
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• SIEMENS
  Siemens Semiconductor Group
• 
• 8 Pages
• 49.14 Kbytes

• LSM670-J
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• SIEMENS
  Siemens Semiconductor Group
• 
• 8 Pages
• 49.14 Kbytes

• LSM670-JM
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• SIEMENS
  Siemens Semiconductor Group
• 
• 8 Pages
• 49.14 Kbytes

• LSM670-K
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• SIEMENS
  Siemens Semiconductor Group
• 
• 8 Pages
• 49.14 Kbytes

• LSM676
• 单路输出，非隔离，3.3VIN，0.8-2.5VOUT10安培DC/ DCAS的SMT封装
• SIEMENS
  Siemens Semiconductor Group
• 
• 7 Pages
• 87.03 Kbytes

LSM10A-D3参数资料

• 电子元器件
• 参数资料

• LSM10A-D3
• 制造商：MURATA；制造商全称：Murata Manufacturing Co., Ltd.；功能描述：Single Output, Non-Isolated, 3.3VIN, 0.8-2.5VOUT 10 Amp DC/DC’s in SMT Packages；